AXVU13G FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
EIC Product Code: AXVU13G V1.0
AXVU13G is a professional FPGA development and validation platform that uses Virtex UltraScale+XCVU13P FPGA chips, rich high-speed interfaces (such as QSFP-DD, QSFP28, and FMC+), and various peripherals, suitable for high-speed data exchange and complex algorithm acceleration.
Product Description
The AXVU13G is a professional-grade FPGA development platform centered on the Xilinx Virtex UltraScale+ XCVU13P FPGA, featuring extensive high-speed communication interfaces (including QSFP-DD and QSFP28), expansion capabilities (via FMC+ and FMC), and debug interfaces, designed for high-bandwidth data processing and complex algorithm acceleration
Applications
● Compute Acceleration
● Machine Learning and AI
● Network Acceleration
● Wired Communications
● 5G Baseband
● Radar
● Test and Measurement
● Emulation and Prototyping
Key Features
System-on-Module（ACVU13）
● AMD/Xilinx Virtex Ultrascale+™:
◆ 16nm FinFET FPGA fabric
◆ System Logic Cells 3,780K，DSP Slices 12,288
◆ Peak INT8 DSP 38.3TOP/s
◆ 76 x GTY, up to 28.21 Gbps, Transceiver
◆ Integrated 100G Ethernet MAC and 150G Interlaken cores
● Pluggable module with 8 x Samtec board-to-board connectors
● 20 GByte DDR4 SDRAM
● 2 x 128 MB QSPI FlashBase Board
● 2 x QSFP-DD (200Gbps)
● 7 x QSFP28 (100Gbps)
● 1 x FMC+
● 1 x FMC HPC
● 26 x SMA（8x RX+8x TX+6x CLK+2x MGT-CLK+2x TRIG）
● 1 x Gigabit Ethernet
● 1 x UART(USB to UART)
● 1 x Micro SD Card Slot
● 1 x JTAG
● 4 x LED
● 1 x KEY
● 1 x DIP Switch
● 12V single supply
● Dimensions: 210x255 mm form factor
Board Features
Featuring the AMD/Xilinx Virtex Ultrascale+™ XCVU13P-2FHGB2104I
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+™ based application.
* The AXVU13G development board consists of a ACVU13 SoM and base board. If you want to purchase ACVU13 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Virtex Ultrascale+™ XCVU13P FPGA development board and Some accessories
The Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCVU13P device surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Mini USB Cable | 1 | USB Downloader Cable / set | 1 |
| 12V Power Adapter | 1 | Heatsink Kit (preinstalled) | 1 |
| SMA Cable | 13 | SD Card | 1 |
Product Matrix
| Product Model | Preferred Model | FPGA Devices | DDR4 SDRAM | QSPI Flash | GTY 28.21Gbps | USD Price | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AXVU13G | √ | XCVU13P-2FHGB2104I | 20GB | 2 x 128MB | 76 | 14976 |
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.
