AXRF67 Dev Board & Kit with AMD Zynq™ US+ RFSoC XCZU67DR
EIC Product Code: AXRF67
The AXRF67 development board, based on the AMD Zynq™ UltraScale+™ RFSoC DFE ZU67DR, is an ideal platform for adaptive radio development. It accelerates prototype evaluation for 5G New Radio (5G NR), radar, and a wide range of high-performance RF applications.
Product Description
The AXRF67 development board is built around the AMD Xilinx Zynq UltraScale+ RFSoC ZU67DR. It provides 4 physical RF-ADC interfaces (2.95GSPS) and 2 physical RF-DAC interfaces (10GSPS), leveraging the chip's full 8-channel capability while offering optimized connectivity for target applications. It supports direct RF sampling below 7.125GHz, delivering a comprehensive solution for 5G communication, radar systems, and wired access testing from teaching labs to research verification.
Applications
● 5G FR1/FR2 Baseband & RF Systems
● Wideband Spectrum Monitoring & Analysis
● Phased-Array Radar / Digital Array Radar (DAR)
● Satellite Communications
● Multi-channel RF Signal Processing (for SDR, test equipment)
● Test & Measurement (T&M) Systems
Key Features
System-on-Module
● AMD/Xilinx Zynq™ Ultrascale+™ DFE ZU67DR:
◆ 489K Logic Cells
◆ 8 x 14 bit 2.5GSPS RF-ADC
◆ 2 x 14 bit 5.9GSPS RF-DAC
◆ 8 x 14 bit 10GSPS RF-DAC
◆ ARM® quad-core Cortex™-A53 up to 1.333GHz
◆ ARM® dual-core Cortex™-R5F up to 533MHz
◆ 16nm FinFET+ FPGA fabric
◆ Hardened DFE (Digital Front-End) with integrated RF-ADC and RF-DAC◆ 4 GB (64-bit) DDR4 SDRAM on PS
◆2 GB (32-bit) DDR4 SDRAM on PL
◆ 128 MB QSPI Flash
● Expansion: 2×400-pin high-speed connectors to the base boardBase Board
● 1 x 100G QSFP28
● 1 x 10G SFP+
● 1 x M.2 SSD (PCIe Gen2 x2)
● 1 x Gigabit Ethernet
● 4× RF-ADC Input Interfaces
● 2× RF-DAC Output Interfaces
● 1 x USB3.0
● 1 x DisplayPort
● 1 x Type-C (JTAG + UART)
● 1 x Micro SD Card Slot
● 2 x PMOD Expansion Interfaces
● 1 x High-precision GPS Module
● 4× User-programmable LEDs
● Power Switch & Reset Button
● 9-40V Wide Voltage DC Input
● Dimensions: 170mm x 170mm form factor
Development Board Features
Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU67DR-2FFVE1156I Adaptive SoC
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.
* The AXRF47 development board consists of a ACRF67 SoM and base board. If you want to purchase ACRF67 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU67DR development board and Some accessories
Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Heatsink Kit (preinstalled) | 1 | 12V power supply | 1 |
| SMA-SMA（20cm） | 4 | SMA-SMA（50cm） | 2 |
| 5G omnidirectional antenna and base | 4 | USB3.0-cable | 1 |
| Ethernet cable | 1 | TF card | 1 |
| TF card reader | 1 | CD supplementary materials | 1 |
Product Matrix
| Product Model | Preferred Model | FPGA Devices | DDR4 SDRAM (PS) | DDR4 SDRAM (PL) | QSPI Flash | RF-ADC | RF-DAC | GTY | GTR | USD Price | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AXRF47 | √ | XCZU47DR-2FFVE1156I | 4 GB | 2 GB | 128 MB | 8 | 8 | 8 | 4 | 14946 | |||||||
| AXRF42 | XCZU42DR-2FFVE1156I | 4 GB | 2 GB | 128 MB | 8 | 8 | 8 | 4 | TBD | ||||||||
| AXRF43 | XCZU43DR-2FFVE1156I | 4 GB | 2 GB | 128 MB | 8 | 8 | 8 | 4 | TBD | ||||||||
| AXRF67 | √ | XCZU67DR-2FFVE1156I | 4 GB | 2 GB | 128 MB | 8 | 8 | 8 | 4 | 10453 |
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.
