AX7450B Dev Board & Kit with AMD Zynq™ 7000 SoC XC7Z100
EIC Product Code: AX7450B
The AX7450B SoC development board equipped with the AMD Zynq™ 7000 SoC-series device with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, suitable for Industrial, Medical, Automotive, Video and Image Processing, Control & Instrumentation and Communication, etc.
Product Description
The AX7450B SoC development board equipped with the AMD/Xilinx Zynq™ 7000 SoC-series XC7Z100 device, delivers standout performance with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, PCIe, FMC HPC, Gigabit Ethernet.
Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (PCIe).
Applications
Automotive
● Road Sign Recognition
● ADAS
● Smart Transportation
Communication Network
● Ethernet Backhaul
● Small Cell Baseband
● Network Switch
● Flexible radio platform
Industrial
● Motor control
● Industrial Control
● Industrial IoT
● Instrumentation
● Smart Grid
Video and Image Processing
● Professional Cameras
● Computer Vision
● Machine Vision
Medical
● Endoscop
● Ultrasound, CT, MRI
Key Features
- ● AMD/Xilinx Zynq™ 7000 SoC:
◆ ARM® dual-core Cortex™-A9 up to 800 MHz
◆ Xilinx Kintex 7 28nm FPGA fabric● 1 GByte (32-bit) DDR3 SDRAM on PS
● 2 GByte (64-bit) DDR3 SDRAM on PL
● 64 MB QSPI Flash
● 8 GB eMMC Flash
● 1 x FMC HPC (FMC has 84 pairs lvds io and 8 pairs GTX)
● 1 x PCIe® Gen2 × 8 (PL) - ● 1 x USB to UART on PS
● 1 x Gigabit Ethernet (1 x PS )
● 1 x USB2.0(OTG)
● 1 x JTAG
● 1 x MicroSD
● LED (1 x PWR + 1 x DONE + 1 x RXD + 1 x TXD + 4 x PL LED)
● KEY (1 x PS RST + 1 x PS KEY)
● 12V single supply
● Dimensions: 190 x 107 mm form factor
Board Features
Featuring the AMD/Xilinx Zynq™ 7000 SoC XC7Z100-2FFG900I
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ 7000 SoC based application.
What's Inside the Box
ALINX AMD Xilinx Zynq™ 7000 SoC XC7Z100 development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA and SoC devices – it is low-profile and covers the whole XC7Z100 device surface.
| Development Board | 1 | Heatsink Kit (preinstalled) | 1 |
|---|---|---|---|
| Mini USB Cable | 2 | USB Downloader Cable / set | 1 |
| 12V Power Adapter | 1 | Card Reader | 1 |
| TF Card | 1 |
Product Matrix
| Product Model | Preferred Model | Zynq 7000 SoC | DDR3 SDRAM (PS) | DDR3 SDRAM (PL) | QSPI Flash | eMMC | USD Price | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AX7450B | √ | XC7Z100-2FFG900I | 1 GB | 2 GB | 64 MB | 8GB | 1083 |
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.
